Jesteśmy producentem opakowań przemysłowych, produkujemy wkłady i opakowania termoformowane, indywidualnie przygotowane pod potrzeby Klientów.
Metoda termoformowanie pozwala osiągać kształty idealnie pasujące i chroniące dany produkt.
Zapraszamy do kontaktu i współpracy.
We are one of the leading
Polish PCB manufacturers for
many electronic industries.
Since 1981, we have been
constantly improving technology and machinery park.
We specialize in the production of doublesided and
singlesided PCBs on laminates FR4, MC PCB, CEM3T.
We produce 2,000 sqm of
PCBs monthly. We carry out
medium and small production batches including 48H
express orders of prototypes.
Technology
Max technological board size in production:590 x 400 mm
Min. track width / min. distance:0.15 mm (6 mils)
Min. hole diameter:0.3 mm
Silkscreen:white Peters , black Peters (for white solder resist)
Surface finishing:HASL tinning, nickel plating, gold plating
Complete mechanical process:CNC drilling, routing, V-cut, punching
Additional marks:date, WM ELTAR logo, client’s logo
Documentation:Gerber RS-274X, drill Excellon
Production Technological Parameters
Maximum customer format – double sided PCBs:560 X 360 mm
Maximum customer format – single sided PCBs:570 x 370 mm
Minimum distance between conductor and board edge:0.5 mm
Minimum distance between tracks:0.15 mm
Minimum track width:0.15 mm
Minimum annular ring width (radius):0.2 mm
Minimum diameter of plated hole:0.3 mm
Minimum diameter of unplated hole:0.4 mm
Permissible offset between copper layer and drilling:0.15 mm
Permissible offset between solder resist and copper layer:0.1 mm
Permissible offset between legend and drilling:0.3 mm
Permissible offset peelable mask and drilling:0.3 mm
Permissible offset carbon paste and drilling:0.3 mm
Scoring line width (laminate thickness 1,55 mm):<= 0.6 mm
Scoring line relative position to nominal position shift:±0.2 mm
Upper and lower scoring line shift:±0.1 mm
Routed dimensions tolerances:±0.20 mm
Minimum distance between routing and conductor:0.30 mm
Solder resist thickness on copper:from 8 to 45 µm
HASL tin thickness :from 1 to 40 µm
ENIG gold and nickel thickness:Au from 0.05 to 0.125 μm Ni from 3.0 to 10 μm
We measure over 130 processes
and product parameters in all
production operations, in line
with our Central Control Plan.
100% of doublesided PCBs
undergo electric testing and
most PCBs undergo Automatic
Optical Inspection (AOI).
We make crosssection measurements reports of manufactured
and entrusted PCBs. We deliver
certificates of quality, and on
request PPAP lev. 2 reports, etc.
We provide technological
support at design stage in order
to optimize production costs.
Customer documentation is
validated at the quotation stage.
We have own system of tracking
specific customer requirements
at each stage of production.
We keep strict standards of
confidentiality to protect your
knowhow and documentation.
Our products are compliant with RoHs directive,
REACH and conflict
minerals legislation.
We have obtained a nonflammability certificate of UL 94V0
class in accordance with the
American norm (E234136).
We have Quality Management
System certificate 90012015
issued by TÜV Rheinland.
Our employees undergo regular
IPCA600 norm trainings.